automatic plating-line PCB manufacturing (Pattern-Plating)

Fully automatic line for production of printed circuit boards (pattern-plating)

• Semi-automatic load/unload station with swivel table
• 1 circulating air dryer with 3 working positions
• 9 copper stations
• 55 positions, incl. 17 storage positions
• 16 vibratory flightbars
• Electronic water-cooled pulse-reverse/ and DC-rectifiers
• Integrated metal stripping station
• Registering a job with or without goods movement
• Pumps are equipped with digital flowmeters
• 2 hoists with enclosure and drip tray and integrated catwalk
• Hoist positioning in the direction of travel by laser measurement
• Fixing of the hoists on the transport-system with a throwing-off safeguard
• Automatic dissolving station for copper oxide
• Copper via filling tank with horizontal movable nozzle register for electrolytic upstream flow on printed circuit boards
• Last generation of insoluble anodes in all copper plating tanks
• Process: Electrolytic copper with via filling and electrolytic tin

• Based on Siemens S7 PLC
• Fully automatic control system „flexible“ or „clock-controlled“
• System supervised by radio remote control
• Fully automated reading of the PCB-Codes with a scanner in the storage area
• Dip sequences freely programmable
• Operation control of the vibratory- flightbars (power and number of ramps)
• Colour-on-screen information re production and plant operation
• Support via modem
• Special on-screen visualization of the copper solving station
• End of work program (unloading of the plant)
• With “line-stop” for short-term maintenance tasks, critical positions are automatically emptied