Automatic Plating-Line PCB maufacturing ( THP, Panel-Plating)

Fully automatic line for production of printed circuit boards

• Line set-up: 1 line
• 1 circulating air dryer with 3 working positions
• 8 copper and 1 tin stations
• 83 positions, incl. 13 storage positions
• 20 vibratory flightbars
• Integrated metal stripping station (2 stations)
• Registering a job with or without goods movement
• 3 hoists with drip tray
• Frequency converters for variable drive and brake speeds
• 2 electroless copper tanks with semi-automatic chemistry transfer and cleaning process
• Line is designed for limited spaces
• Automatic copper dissolving station for supply of copper oxid, with crane as supporting tool
• Copper via filling tank with horizontal movable nozzle register for electrolytic upstream flow on printed circuit boards
• Last generation of insoluble anodes in all copper plating tanks
• Floating blending shields for different sizes of printed circuit boards
• Process: Electroless copper, electrolytic copper with via filling and electrolytic tin

• Based on Siemens S7 PLC
• System supervised by radio remote control
• Dip sequences freely programmable
• Operation control of motors of the vibratory- flightbars
• Colour-on-screen information re production and plant operation
• Support via modem
• Special on-screen visualization of the copper solving station and of cleaning electroless copper
• Control system for handling of all process flows