Automatic Plating-Line PCB maufacturing ( THP, Panel-Plating)

Project description

Fully automatic line for production of printed circuit boards

  • Line set-up: 1 line
  • 1 circulating air dryer with 3 working positions
  • 8 copper and 1 tin stations
  • 83 positions, incl. 13 storage positions
  • 20 vibratory flightbars
  • Integrated metal stripping station (2 stations)
  • Registering a job with or without goods movement
  • 3 hoists with drip tray
  • Frequency converters for variable drive and brake speeds
  • 2 electroless copper tanks with semi-automatic chemistry transfer and cleaning process
  • Line is designed for limited spaces
  • Automatic copper dissolving station for supply of copper oxid, with crane as supporting tool
  • Copper via filling tank with horizontal movable nozzle register for electrolytic upstream flow on printed circuit boards
  • Last generation of insoluble anodes in all copper plating tanks
  • Floating blending shields for different sizes of printed circuit boards
  • Process: Electroless copper, electrolytic copper with via filling and electrolytic tin

Control system features

  • Based on Siemens S7 PLC
  • System supervised by radio remote control
  • Dip sequences freely programmable
  • Operation control of motors of the vibratory- flightbars
  • Colour-on-screen information re production and plant operation
  • Support via modem
  • Special on-screen visualization of the copper solving station and of cleaning electroless copper
  • Control system for handling of all process flows

Key data

space requirements

27,1 x 4,3 x 5,7 meter

construction year


inside dimensions ( rinsing-tank)

210 x 3200 x 900 mm


cycle time 13,2 min → 7,7 m²/h

ProjectVollautomatische Anlage für die Herstellung von Leiterplatten (Durchkontaktierung)