SMT Plating-Line (electroless Ni, Pd, Au)

Project description

Automatic printed circuit board line

  • Line set-up: 2 lines
  • 64 processing positions, incl. 4 storage positions
  • 5 side arm hoists with enclosure and integrated spray system and drip tray
  • Cross transfer wet
  • 4 electroless nickel tanks incl. 3 working positions
  • 3 palladium tanks, indirectly heated
  • 4 gold tanks
  • 1 load/unload station, 1 unload station wet, 1 dryer
  • Frequency converter & positional control for variable drive, lift and brake speed
  • Drive positioning system is equipped with an incremental rotary encoder
  • Air bumpers for flightbars
  • 5 goods agitations, variable speed
  • Dosing pumps with flow-meter

Control system features

  • Based on Allen Bradley PLC
  • Fully automatic control system
  • Emergency control system in case of PLC failure
  • Hand-held remote module allows manual control of the hoist without interrupting scheduled processes
  • Dip sequences freely programmable
  • On-screen information re plant operation
  • Logging of line data with possibility to complete later on
  • Support via modem

Key data

space requirements

20 x 6,5 x 4 Meter

construction year


inner dimensions (rinsing-tank)

350 x 900 x 900 mm


7,5 min


Hofstetter PCB AG

ClientHofstetter PCB AG
ProjectLeiterplattenautomat SMT